Founded in 2011, ‌Suzhou SESI Electronic Co., Ltd.‌ has established itself as a leading player in the field of thermal interface materials (TIM). Nestled in Wuzhong District, Suzhou, China, we are strategically situated adjacent to the bustling Suzhou New District and the picturesque Tai Lake tourist resort. With excellent transportation infrastructure surrounding our facility, we enjoy seamless connectivity, facilitating smooth operations and timely deliveries.

Operating Principle

At Suzhou SESI, we are guided by a core philosophy that "altruism is egoism." This principle embodies our commitment to prioritizing customer satisfaction, quality, technology, and process innovation. We operate within the ISO-9001 quality management system, ensuring that every product and service we provide meets the highest standards of excellence. Our dedication to these principles has been the cornerstone of our success and growth over the years.

Business Scope

Our primary focus lies in the production of a comprehensive range of thermal interface materials. Our portfolio includes:

• ‌Thermal Conductive Gap Pad Materials‌: Designed to fill the microscopic gaps between heat-generating components and heat sinks, ensuring efficient heat transfer.
• ‌Thermally Conductive Insulators‌: Providing both thermal conductivity and electrical insulation, these materials are essential in various electronic applications.
• ‌Pouring Sealants of Thermal Conductivity‌: High-performance sealants that offer thermal conductivity and protect against environmental factors such as moisture and dust.
• ‌Thermal Conductive Greases‌: Formulated to provide excellent thermal conductivity, lubrication, and electrical insulation, these greases are ideal for applications requiring a thin layer of thermal interface.
• ‌Die-Cutting Insulator Materials‌: Custom-cut insulating materials from materials like PET, PC, and PP, tailored to meet specific customer requirements.
• ‌EMI Materials‌: Conductive fabrics, foams, and adhesive products from reputable brands like 3M, Nitto, and Tesa, offering electromagnetic interference (EMI) shielding solutions.

Applications

Our products find widespread application across various industries, showcasing our versatility and commitment to addressing diverse thermal management needs. Our materials are utilized in:

• ‌Eco-Friendly Automobiles‌: Ensuring efficient heat dissipation in electric vehicles and hybrid systems.
• ‌3C Products‌: Improving the thermal performance of smartphones, tablets, and other consumer electronics.
• ‌Computer Peripherals‌: Maintaining optimal operating temperatures in hard drives, graphics cards, and other computer components.
• ‌Solar Equipment‌: Enhancing the efficiency and reliability of solar panels and associated electronics.
• ‌TVs and LEDs‌: Ensuring long-lasting performance and reliability in high-definition displays and lighting systems.
• ‌Adaptors and Power Storage‌: Managing heat generation in power converters, batteries, and other energy storage solutions.

Commitment to Quality and Innovation

Suzhou SESI is dedicated to continuous improvement and innovation. We invest heavily in research and development, staying abreast of the latest advancements in thermal management technology. Our team of experienced engineers and technicians works tirelessly to develop new products and enhance existing ones, ensuring that our customers always have access to the best possible solutions.

As a company with a rich history and a bright future, Suzhou SESI Electronic Co., Ltd. is proud to be at the forefront of thermal interface material technology. We are committed to providing our customers with high-quality products, exceptional service, and innovative solutions. Whether you are a manufacturer, a system integrator, or an end-user, we invite you to explore our product range and discover how Suzhou SESI can help you achieve optimal thermal management in your applications. Contact us today to learn more about our company and our products.

Heat can be conductive efficiently, protect the Heating components

 

 

Thermal conductivity coefficient (K)

 

Through unit area and thickness, and leading to temperature difference of 2 surfaces is 1 (K, or C), the ratio of its heat and time, is Thermal conductive  coefficient, it is material property，nothing to do with parts size and shape.

 

 

Thermal resistance (R)

 

The resistance of preventing heat from passing through an interface or material , which is related to thickness and area. 

Rcontact：Contact Resistance