Materials with 1-10W/mK thermal conductivity efficiently transfer heat, reducing device temps by 20+%, ideal for CPU/GPU cooling and extending component lifespan.
Customizable 0.25-14mm thickness with >30% compressibility, eliminating air gaps for optimal heat dissipation in tight spaces like smartphones and EV battery packs.
UL/ROHS certified, >5kV breakdown voltage, ensuring both thermal conduction and electrical insulation for high-voltage applications like EVs and solar inverters.
Die-cuttable adhesive films and ±1% precision glue dispensing streamline SMT assembly, boosting production efficiency by 40% for 3C electronics manufacturing.
Stable performance from -40°C to 200°C, <5% thermal decay after 2000hrs aging, perfect for harsh environments like 5G base stations and industrial motors.
Silicone-free REACH-compliant formulas cut costs by 50% vs liquid TIMs, with recyclable roll formats supporting sustainable manufacturing.
Our thermally conductive potting compounds use only high-purity raw materials, ensuring consistent 1.5-6.0W/mK thermal conductivity and UL94 V-0 flame resistance for maximum reliability.
We offer tailored solutions with adjustable viscosity, cure time, and thermal properties to perfectly match your specific application requirements and production processes.
Every batch undergoes 12+ quality tests including thermal cycling, adhesion strength, and dielectric strength verification to guarantee product consistency and performance.
Our experienced engineers provide application guidance from prototype to mass production, helping optimize your potting process for best results and cost efficiency.